Magnetron Sputtering Systems
PVD Products manufactures complete integrated sputtering systems to meet your specific deposition requirements. These systems can be configured with multiple RF and/or DC magnetron sources ranging in size from 1 inch (25 mm) to 8 inches (200 mm) in diameter. We can provide systems to handle wafers up to 300 mm in diameter, heating up to 900°C, and RF bias with additional ports for diagnostics such as Reflection High-Energy Electron Diffraction (RHEED), ellipsometry, and Multi-beam Optical Sensors (MOSS) for in-situ stress measurement.
UHV sputtering and evaporation system for 4-inch wafers with heating to 850°C, RF bias, three UHV magnetrons with in-situ tilt, and three-pocket UHV e-beam source. Located at NIST, Boulder CO.
UHV sputtering and evaporation system with HP RHEED and in-situ ellipsometry. Includes a 4-inch wafer holder with heating to 850°C with RF bias, three 2-inch UHV magnetrons with in-situ tilt, and three-pocket UHV e-beam source.
Sputtering chamber for a 4” diameter wafer which can be heated to 850°C with RF bias, loadlock, and six 2” magnetrons with manual in-situ tilt.
Sputter-down system for 4-inch diameter substrates with RF bias, load lock, and four 2-inch magnetrons.
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